创业芯舟双周刊分IC（集成电路）和AI（人工智能）两版，内容涵盖近期学术界的前沿成果和工业界的行业、投资、产品资讯。ARM或成今年最大IPO，他们却在去“ARM化”。英伟达净利润暴涨843%，GPU大热、存储器厂商积极扩产HBM。中国互联网大厂订购50亿美元英伟达芯片 全球GPU短缺暂难缓解。中芯国际发布第二季度财报，产能利用率上涨10.2%。存储大厂目标年底NAND库存正常化。（VLSI-SoC 2023）SoftFlow: Automated HW-SW Confidentiality Verification for Embedded Processors。(Seoul National University) CiFHER: A Chiplet-Based FHE Accelerator with a Resizable Structure。（James Cook， York）A Review of Graphene-Based Memristive Neuromorphic Devices and Circuits。（Gatech）Flexible Hybrid Electronics: Future Standards For Next-Gen 5GMmWave Wearable And Conformal Applications。（Nature Communications）Fabrication of p-type 2D single-crystalline transistor arrays with Fermi-level-tuned van der Waals semimetal electrodes。

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