创业芯舟双周刊(IC版)第9期
创业芯舟双周刊(IC版)第9期
#资讯  #创业芯舟双周刊 
创业芯舟双周刊分IC(集成电路)和AI(人工智能)两版,内容涵盖近期学术界的前沿成果和工业界的行业、投资、产品资讯。拜登下令禁止对中国敏感高科技产业的新投资。Synopsys探索芯片行业趋势与EDA中的人工智能。Cadence:人工智能在设计领域的应用展望。英伟达发布下一代GH200 Grace Hopper超级芯片平台,面向加速计算和生成式人工智能时代。英特尔首席执行官对芯片基金和出口管制表示担忧。(Yale)HyDe: A Hybrid PCM/FeFET/SRAM Device-search for Optimizing Area and Energy-efficiencies in Analog IMC Platforms。(Samsung)Mitigating Memory Wall Effects in CNN Engines with On-the-Fly Weights Generation。(Intel, IC)eGPU: A 750 MHz Class Soft GPGPU for FPGA。(Gatech)RV-CURE: A RISC-V Capability Architecture for Full Memory Safety。(ETH)Fast Shared-Memory Barrier Synchronization for a 1024-Cores RISC-V Many-Core Cluster。
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