#资讯
#创业芯舟双周刊
创业芯舟双周刊分IC(集成电路)和AI(人工智能)两版,内容涵盖近期学术界的前沿成果和工业界的行业、投资、产品资讯。ARM或成今年最大IPO,他们却在去“ARM化”。英伟达净利润暴涨843%,GPU大热、存储器厂商积极扩产HBM。中国互联网大厂订购50亿美元英伟达芯片 全球GPU短缺暂难缓解。中芯国际发布第二季度财报,产能利用率上涨10.2%。存储大厂目标年底NAND库存正常化。(VLSI-SoC 2023)SoftFlow: Automated HW-SW
Confidentiality Verification for Embedded Processors。(Seoul National University) CiFHER: A Chiplet-Based FHE Accelerator with a Resizable Structure。(James Cook, York)A Review of Graphene-Based Memristive Neuromorphic Devices and Circuits。(Gatech)Flexible Hybrid Electronics: Future Standards For Next-Gen 5GMmWave Wearable And Conformal Applications。(Nature Communications)Fabrication of p-type 2D single-crystalline transistor arrays with Fermi-level-tuned van der Waals semimetal electrodes。